This equipment coats a uniform thin film of desired thickness by dropping the coating material in liquid form on the substrate or wafer and rotating it at high speed. Generally, spin coating results in the formation of edge beads due to the centrifugal force, but this equipment is equipped with a spray nozzle for edge bead removal (EBR).
1.Rotation speed: 0 – 12,000 rpm (± 1 rpm/sec)
2.Direction of rotation: Clockwise/counterclockwise
3.Maximum acceleration: 30,000 rpm (controlled in the unit of 1 rpm)
4.Material: Natural polypropylene (NPP)
5.Max substrate diameter: 260 mm (round) or 6ʺ x 6ʺ (square)
This is used in the MEMS process to produce microstructures and microfluidic channels. It can be widely used in the fields of semiconductor, sensor engineering, electronic physics, electrical engineering, mechanical engineering, energy conversion characteristic experiments, smart grid-related electricity, optical communication devices and parts manufacturing.
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